CAREER PATHS

Chip careers, mapped to what you can learn.

The semiconductor industry hires for far more than one job title. Pick a role to see what it involves and which Fab Path units build the foundations for it.

Packaging & test engineer

Turns finished dies into shipped parts: dicing, die attach, wire and flip-chip bonding, encapsulation, and test.

LEARN IT HERE

Energy-storage & materials R&D

Develops electrode materials and devices, from supercapacitors to batteries, with electrochemistry and microfabrication.

LEARN IT HERE

Where these roles exist

Foundries, integrated device makers, equipment suppliers, fabless design companies, packaging and test houses, national labs, and university cleanrooms all hire for these functions.

  • Foundries (e.g. TSMC, GlobalFoundries)
  • Device makers (e.g. Intel, Texas Instruments)
  • Equipment (e.g. ASML, Applied Materials, Lam Research)
  • Fabless design (e.g. Qualcomm, NVIDIA)
  • Packaging & test houses
  • National labs & university cleanrooms

An honest scope note. Fab Path teaches the fundamentals underneath these roles. It is not company-specific training, it doesn't cover any company's proprietary processes, and advanced-node topics such as EUV lithography are not covered.