Learn how chips get made.
From cleanroom to transistor: interactive lessons and games on lithography, etching, MOSFETs, and microfabrication. Built for students heading into semiconductors.
- 100+ lessons
- Games & practice in every unit
Every chip starts as a grid of identical dies.
Amber dies fail inspection. Cleanrooms exist to keep them rare.
HOW IT WORKS
Learn it, play it, practice it.
Every unit follows the same loop, so you spend your time on the parts you don't know yet.
01 · LEARN
Short illustrated lessons
Cross-sections, curves, and worked equations, then a quiz to lock it in.
02 · PLAY
Hands-on games
Order a process flow, read a bias point, size a component, name a curve.
03 · PRACTICE
Targets what you miss
Practice sessions pull together the questions you get wrong most.
YOUR PROGRESS
Your Fab Path journey.
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Across All Courses
COURSE CATALOG
Pick a course
Four courses are live today. The rest are on the way, built the same way these were, unit by unit.
WHAT YOU'LL COVER
The fundamentals behind chip manufacturing.
The ideas underneath cleanroom work, process flows, devices, and packaging.
- Silicon & wafer manufacturing
- Photolithography
- Etch & deposition
- Cleanroom practice
- CMOS fabrication
- MOSFET physics
- Process integration
- MEMS sensors
- Packaging
- Energy storage
CAREER PATHS
See where the skills lead.
Process, device, equipment, design, and packaging roles all build on the same foundations. Here is which units map to which roles.
Process engineer
Owns the steps that build a chip (deposition, etch, lithography, cleans) and tunes them for yield and repeatability.
Device engineer
Connects process choices to electrical behavior: threshold voltage, drive current, leakage, and reliability.
Equipment & tool engineer
Keeps the lithography scanners, etchers, and deposition chambers running: vacuum, plasma, motion control, and uptime.
Circuit & RF design engineer
Designs the circuits on the chip using a foundry's transistor models, so gain, noise, and bias have to be intuitive.
Packaging & test engineer
Turns finished dies into shipped parts: dicing, die attach, wire and flip-chip bonding, encapsulation, and test.