PART 6 • YIELD AND METROLOGY
Yield and Metrology
Defects
The flaws that turn a good die into a bad one
Metrology
Measuring what was actually built, not just what was designed
Yield models
Turning defect data into a number that predicts profit
THE DEFINITION
Good die, divided by total die
Yield is the fraction of die on a wafer that pass every test and actually work. A wafer might hold hundreds of die, and yield simply asks how many of them came out good. It sounds simple, but almost everything in a fab exists to push that one number up.
WHY IT'S EVERYTHING
Cost scales the wrong way with yield
GOOD DIE PER WAFER
Bigger die, fewer chances
A wafer's usable area is fixed, and die near the very edge are usually thrown out because the pattern there is incomplete. Smaller die fit more chances per wafer and lose a smaller fraction to that edge, which is one reason die size is such a carefully guarded design choice.
A WAFER MAP
One square, one die, one verdict
After testing, every die on the wafer gets colored by whether it passed. Most of this map is good die, with a scatter of individual failures spread randomly across it.
WHAT LOWERS YIELD
Three broad causes
Defects
Particles, pattern flaws, and contamination that physically break a die
Parametric failures
A die that works, but too slowly or with too much leakage
Design marginality
A design too sensitive to the process's normal variation
UNIT 31 STUDY COMPLETE
Ready for the Fab Challenge?
You've covered what yield means, and why it decides whether a fab makes money.