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MICROMACHINING

Two major fabrication strategies

Bulk Micromachining

Mechanical features are formed by etching deeply into the silicon substrate.

Surface Micromachining

Structures are built layer by layer on the wafer surface.

Bulk: shape the substrate itself.

Surface: build structures above the substrate.

BULK MICROMACHINING

Remove material from the wafer.

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Bulk micromachining creates mechanical features by etching into the silicon substrate.

Cavities, trenches, membranes, channels, and other structures can be produced this way.

The substrate itself becomes the mechanical geometry.

SURFACE MICROMACHINING

Build structures layer by layer.

Surface micromachining builds thin-film structures on top of the wafer.

Sacrificial layers can later be removed from beneath structural layers to create free-standing mechanical structures.

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Structural layer: remains in the finished device.

Sacrificial layer: is intentionally removed.

UNIT 9 STUDY COMPLETE

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