WAFER-LEVEL PROCESS

Oxidation

Oxidation is one of the fundamental wafer-level fabrication processes identified in the microfabrication toolbox.

SiO₂
━━━━━━━━━━━
Si

The important idea for this part is that fabrication may modify the wafer itself before pattern transfer begins.

Wafer-level processing changes or adds material across the wafer.

WAFER-LEVEL PROCESS

Doping

Doping deliberately changes the electrical properties of silicon by introducing selected impurity atoms.

Listed as one semiconductor fabrication method for introducing dopants.

Another semiconductor processing method used to introduce dopants.

Doping allows engineers to create regions with different electrical behavior within the same silicon wafer.

THIN-FILM DEPOSITION

Thin-film deposition creates material layers that can later be patterned into functional structures.

Chemical vapor deposition can form thin films such as polysilicon and other process layers.

A deposition technique commonly used for thin material layers.

Another thin-film deposition method used in microfabrication.

Microfabrication alternates between adding material and removing material.

UNIT 10 STUDY COMPLETE

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You've covered Oxidation, Doping & Deposition.